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Quantum Leap: New Semiconductor Material Breaks Mobility Record, Enabling Faster Chips

Imagine a world where your devices are significantly faster and consume far less energy. Scientists are edging closer to that reality with a groundbreaking achievement in semiconductor technology. Researchers at the University of Warwick and the National Research Council of Canada have engineered a silicon-compatible material that boasts the highest “hole mobility” ever recorded. This breakthrough could revolutionize electronics, paving the way for quantum computing and more efficient devices.

## The Germanium Comeback

Silicon has been the dominant material in semiconductors for decades, but its physical limitations are becoming increasingly apparent as devices shrink and demand more power. Germanium, which was used in early transistors, is experiencing a resurgence thanks to its superior properties. By creating a nanometer-thin layer of strained germanium on silicon, the research team has unlocked unprecedented efficiency in charge movement.

The team’s new material is compressively strained germanium-on-silicon (cs-GoS), and combines world-leading mobility with industrial scalability. According to Maksym Myronov, Associate Professor at the University of Warwick, this is a “key step toward practical quantum and classical large-scale integrated circuits.”

## Breaking the Mobility Barrier

The key to this innovation lies in carefully controlling the strain applied to the germanium layer. This creates an exceptionally clean crystal structure that allows electrical charge to flow with minimal resistance. Tests have shown a record hole mobility of 7.15 million cm² per volt-second, far exceeding the performance of standard silicon. This translates to faster chips that require less energy.

## Quantum and Beyond

This advancement holds immense potential for various applications. Dr. Sergei Studenikin, Principal Research Officer at the National Research Council of Canada, notes that it “opens the door to faster, more energy-efficient electronics and quantum devices that are fully compatible with existing silicon technology.” From quantum information processing and AI hardware to data centers with reduced energy consumption, the possibilities are vast. The new pathway for ultra-fast, low-power electronics will likely accelerate innovation across many technologies.